新產(chǎn)品·新技術信息

3M開發(fā)一款透明聚酯薄膜壓敏膠帶2698

來源：林中祥膠粘劑技術信息網(wǎng)2015年06月11日

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3M Develops Pressure Sensitive Cover Tape 2698, a Transparent Polyester Film Tape

ST. PAUL, Minn -- Ever-shrinking electronic component sizes, driven by wafer-level chip scale packaging, demand that circuit board manufacturers deliver performance, speed and reliability in these advanced and ultra-small packages. A new generation of cover tape from 3M enables near-flawless placement of today’s shrinking chips on circuit boards without sticking, static charge or contamination.

Combined with longer reels, 3M Pressure-Sensitive Cover Tape 2698 helps to eliminate pick-and-place errors, minimize down-time and increase productivity ? all at no greater cost than other tape.

Wafer-level chip scale packages and other electronic components are embedded into circuit boards at high-speed using a stamping machine that picks up components from reels of carrier tape and stamps them onto each board. The thinner, lighter nature of these packages can lead to unit stick. As components continue to become smaller, only the highest quality tape can ensure accurate feeding, picking and placement.

3M Pressure-Sensitive Cover Tape 2698 is a transparent, polyester film tape with synthetic, room-temperature, pressure-sensitive adhesive zones at its sides. It is available in standard widths and 600 m-long reels designed to reduce changeover time and enable productivity improvements. It will work in existing industry-standard equipment.

Benefits include: