Solid resol-type phenolic resin and method of manufacturing the same

United States Patent（美國專利）：8742056

Abstract：Disclosed is a solid resol-type phenolic resin having: methylol groups and dimethylene ether bonds, as functional groups bound to phenolic nuclei; a content of methylol group, per 1 mol of the phenolic nuclei, of 0.8 mol or more and 1.3 mol or less; a content of dimethylene ether bond, per 1 mol of the phenolic nuclei, of 0.1 mol or less; a weight-average molecular weight of a tetrahydrofuran-soluble fraction, measured by gel permeation chromatography (GPC), of 800 or larger and 4,000 or smaller; and a content of mononuclear phenolic compound of 10% by weight or less.

Problems to be Solved by the Invention：According to findings of the present inventors, the solid resol-type phenolic resin described in the above-mentioned Patent Document was suffering from slow curing time, as a result of adjustment of the number of the dimethylene ether bonds in the resin to 0.5 mol or more, since the dimethylene ether bonds transform to produce methylene bridges only after once being decomposed in the process of curing.

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